征稿会议：ICMC & AIIM 2025（https://www.ais.cn/attendees/index/J6RYV2）

征稿详情：https://www.isaiim.com/call_for_paper

*成都信息工程大学学生投稿填写邀请码：CUIT，均可享受每篇优惠400元！

2025 lnternational Conference on Membrane Computing & International Symposium on Artificial Intelligence and Intelligent Manufacturing (ICMC & AIIM 2025) will be held on September 19-21, 2025 in Chengdu, China. 2025年国际膜计算会议暨人工智能与智能制造国际研讨会（ICMC & AIIM 2025）将于2025年9月19-21日在中国-成都召开。

All the submissions, after undergoing strict review, the ultimately accepted papers will be submitted for publication in the form of a conference proceedings to IEEE (Institute of Electrical and Electronics Engineers), with the confirmed ISBN: 979-8-3315-9593-7. After being published, they will be submitted by the publisher to IEEE Xplore, EI Compendex and Scopus for retrieval.

所有的投稿经过严格的审稿之后，最终所录用的论文将以会议论文集形式递交IEEE（Institute of Electrical and Electronics Engineers）出版，已确定ISBN号：979-8-3315-9593-7。见刊后由出版社提交至IEEE Xplore，EI Compendex和Scopus 检索。

英文网站：https://www.isaiim.com/

中文网站：https://www.ais.cn/attendees/index/J6RYV2

成都信息工程大学专属优惠邀请码：CUIT，投稿填写邀请码可享受每篇优惠400元，专属优惠链接：https://www.ais.cn/attendees/paperSubmit/J6RYV2?invite=CUIT

具体内容可咨询大会秘书（叶秘书：19120688609，陆秘书：18122341933）